Thermal Analyzer

Purpose:

Board thermal operating conditions analysis

Prevention of component overheating

Capabilities and Features:

Thermal process modeling on the board

Temperature distribution visualization

Detection of hot spots and potential issues

Heat dissipation efficiency assessment

Component placement optimization for better cooling

Connections with Other Sections:

Interacts with PCB Editor for component placement analysis

Integrates with 3D Visualization for thermal field visualization

Connected with Component Library Manager for obtaining component thermal characteristics